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AF500-202005
- Mfr.Part #
- AF500-202005
- Manufacturer
- CUI Devices
- Package/Case
- -
- Datasheet
- Download
- Description
- Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 3.0 W/m*K Thermal Conductivity
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- Manufacturer :
- CUI Devices
- Product Category :
- Thermal Interface Products
- Breakdown Voltage :
- 2.5 kVAC
- Color :
- Gray
- Length :
- 20 mm
- Material :
- Non-Silicone Elastomer
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 45 C
- Product :
- Thermally Conductive Gap Pad
- Series :
- AF500
- Tensile Strength :
- 30 psi
- Thermal Conductivity :
- 3 W/m-K
- Thickness :
- 0.5 mm
- Width :
- 20 mm
- Datasheets
- AF500-202005
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Catalog related products
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| AF500-101005 | CUI Devices | 4 | Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 3.0 W/m*K Thermal Conductivity |
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| AF500-303005 | CUI Devices | 30 | Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 3.0 W/m*K Thermal Conductivity |
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| AF500-505005 | CUI Devices | 17 | Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 3.0 W/m*K Thermal Conductivity |
| AF500-707005 | CUI Devices | 5 | Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 3.0 W/m*K Thermal Conductivity |
