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341900F00000G
- Mfr.Part #
- 341900F00000G
- Manufacturer
- Aavid, Thermal Division of Boyd Corporation
- Package/Case
- -
- Datasheet
- Download
- Description
- Heat Sinks Thin-Fin, Board Level, Stamped Heat Sink for PCI/AGP Chip Sets, Thin Fin, Copper, Horizontal/Vertical Mounting, 25.4x76.2x0.33mm
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- Manufacturer :
- Aavid, Thermal Division of Boyd Corporation
- Product Category :
- Heat Sinks
- Designed for :
- BGA, PGA, QFP
- Heatsink Material :
- Copper
- Height :
- 0.33 mm
- Length :
- 76.2 mm
- Mounting Style :
- Adhesive
- Product :
- Heat Sinks
- Width :
- 25.4 mm
- Datasheets
- 341900F00000G
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Aavid, Thermal Division of Boyd CorporationHeat Sinks Heat Pipe, Round, Sintered Wick, 8mm Diameter, 100mm Length, 0.3mm Wall Thickness, 0.8mm Wick Thickness
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Aavid, Thermal Division of Boyd CorporationHeat Sinks Heat Pipe, Round, Sintered Wick, 5mm Diameter, 97mm Length, 0.3mm Wall Thickness, 0.7mm Wick Thickness
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Aavid, Thermal Division of Boyd CorporationHeat Sinks Heat Pipe, Round, Sintered Wick, 6mm Diameter, 150mm Length, 0.3mm Wall Thickness, 0.8mm Wick Thickness
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