info@yc-chip.com
- Manufacturer :
- SECO
- Product Category :
- Heat Sinks
- Fin Style :
- -
- Height :
- 30 mm
- Length :
- 95 mm
- Mounting Style :
- Panel
- Product :
- Heat Sinks
- Width :
- 95 mm
- Datasheets
- MB75-DISS-3-PK
Manufacturer related products
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SECOModules Accessories Q7 - CQ7-A42 - Carrier Board for Qseven rel. 2.0 Compliant modules on 3.5" Form factor - DisplayPort - 2nd Ethernet Port - LVDS - Debug Port
Catalog related products
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Advanced Thermal SolutionsHeat Sinks Cooler Backing Plate, High Performance, 96mm Length, 96mm Width, 80mm Hole to Hole, 6mm Standoff Height, 70mm Inner Length, 70mm Inner Width, AI Material
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Related products
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| MB75-3001-1211-C0 | SECO | 5 | Computer-On-Modules - COM COMe-B75-CT6 w/AMD Ryzen Embedded V1202B @ 2.5GHz - Packet Switch - Ethernet Contr. I210 - EDP Port - HUB - TPM - Comm. Temp |
| MB75-4001-1211-C0 | SECO | 5,000 | Computer-On-Modules - COM COMe-B75-CT6 w/AMD Ryzen Embedded V1605B @ 2.0GHz - Packet Switch - Ethernet Contr. I210 - EDP Port - HUB - TPM - Comm. Temp |
| MB75-4001-2111-C0 | SECO | 5,000 | Computer-On-Modules - COM COMe-B75-CT6 w/AMD Ryzen Embedded V1605B @ 2.0GHz - Ethernet Contr. I211 - EDP Port - HUB - Packet Switch - Comm. Temp |
| MB75-6001-2111-C0 | SECO | 2 | Computer-On-Modules - COM COMe-B75-CT6 w/AMD Ryzen Embedded V1807B @ 3.35GHz - Ethernet Contr. I211 - EDP Port - HUB - Packet Switch - Comm. Temp |
| MB75-6002-1111-C0 | SECO | 5,000 | Computer-On-Modules - COM COMe-B75-CT6 w/AMD Ryzen Embedded V1807B @ 3.35GHz - Ethernet Contr. I210 - EDP Port - HUB - Comm. Temp |
| MB75-6002-1211-C0 | SECO | 5,000 | Computer-On-Modules - COM COMe-B75-CT6 w/AMD Ryzen Embedded V1807B @ 3.35GHz - Ethernet Contr. I210 - EDP Port - HUB - TPM - Comm. Temp |
| MB75-DISS-1-PK | SECO | 5,000 | Heat Sinks COM Express Type 6 - COMe-B75-CT6 Heat Spreader (PASSIVE) - Packaged |
