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EDMHSCP12201001
- Mfr.Part #
- EDMHSCP12201001
- Manufacturer
- TechNexion
- Package/Case
- -
- Datasheet
- Download
- Description
- Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.0 MM THICKNESS FOR MAPBGA AND UNLIDDED NXP CPUS + MYLAR
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- Manufacturer :
- TechNexion
- Product Category :
- Heat Sinks
- Designed for :
- MAPBGA, CPUS + MYLAR
- Height :
- 1 mm
- Length :
- 20 mm
- Mounting Style :
- Screw
- Product :
- Heat Sinks
- Width :
- 20 mm
- Datasheets
- EDMHSCP12201001
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Related products
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| EDMHS12M2T2020075KIT | Wandboard | 5,000 | Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 0.75 MM THICKNESS FOR NXP I.MX6 DUAL / QUAD / QUADPLUS LIDDED OR I.MX8M |
| EDMHS12M2T2020125KIT | TechNexion | 3 | Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.25 MM THICKNESS FOR NXP I.MX6 SOLO / DUALLITE |
| EDMHS12M2T2020150KIT | Wandboard | 25 | Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.50 MM THICKNESS FOR NXP I.MX6UL / ULL OR I.MX6 DUAL / QUAD / QUADPLUS UNLIDDED OR I.MX7 |
| EDMHSCP12200501 | TechNexion | 4 | Heat Sinks EDM COMPACT 12mm PASS HEATSINK |
