info@yc-chip.com
30137
- Mfr.Part #
- 30137
- Manufacturer
- Trenz Electronic
- Package/Case
- -
- Datasheet
- Download
- Description
- Heat Sinks Heat Sink for Trenz Electronic MPSoC Modules TE0808 Revision 4
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- Manufacturer :
- Trenz Electronic
- Product Category :
- Heat Sinks
- Designed for :
- TE0808
- Fin Style :
- Forged Fin
- Height :
- 15 mm
- Length :
- 31 mm
- Product :
- Heat Sinks
- Width :
- 31 mm
- Datasheets
- 30137
Manufacturer related products
-
-
Trenz ElectronicModules Accessories TEF1002 - Carrier board for Trenz Electronic modules with 4 x 5 cm form factor -
Trenz ElectronicModules Accessories UltraITX+ Baseboard for Trenz Electronic TE080X UltraSOM+
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Trenz ElectronicModules Accessories TE0703 - Carrier board for Trenz Electronic modules with 4 x 5 cm form factor
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Catalog related products
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Advanced Thermal SolutionsHeat Sinks Cooler Backing Plate, High Performance, 96mm Length, 96mm Width, 80mm Hole to Hole, 6mm Standoff Height, 70mm Inner Length, 70mm Inner Width, AI Material
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