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EDMHS12M2T2020150KIT
- Mfr.Part #
- EDMHS12M2T2020150KIT
- Manufacturer
- Wandboard
- Package/Case
- -
- Datasheet
- Download
- Description
- Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.50 MM THICKNESS FOR NXP I.MX6UL / ULL OR I.MX6 DUAL / QUAD / QUADPLUS UNLIDDED OR I.MX7
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- Manufacturer :
- Wandboard
- Product Category :
- Heat Sinks
- Designed for :
- i.MX 6Dual/Quad/Quadplus, i.MX7
- Fin Style :
- Straight Fin
- Mounting Style :
- Screw
- Product :
- Heat Sinks
- Datasheets
- EDMHS12M2T2020150KIT
Manufacturer related products
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-
WandboardHeat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 1.50 MM THICKNESS FOR NXP i.MX6 UL/ULL OR i.MX6 QUAD UNLIDDED or i.MX7 -
WandboardHeat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 0.75 MM THICKNESS FOR NXP I.MX6 DUAL / QUAD / QUADPLUS LIDDED OR I.MX8M
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WandboardHeat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 1.25 MM THICKNESS FOR NXP i.MX6 SOLO OR DUALLITE
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Catalog related products
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Advanced Thermal SolutionsHeat Sinks Cooler Backing Plate, High Performance, 96mm Length, 96mm Width, 80mm Hole to Hole, 6mm Standoff Height, 70mm Inner Length, 70mm Inner Width, AI Material
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Related products
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| EDMHS12M2T2020075KIT | Wandboard | 5,000 | Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 0.75 MM THICKNESS FOR NXP I.MX6 DUAL / QUAD / QUADPLUS LIDDED OR I.MX8M |
| EDMHS12M2T2020125KIT | TechNexion | 3 | Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.25 MM THICKNESS FOR NXP I.MX6 SOLO / DUALLITE |
| EDMHSCP12200501 | TechNexion | 4 | Heat Sinks EDM COMPACT 12mm PASS HEATSINK |
| EDMHSCP12201001 | TechNexion | 5,000 | Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.0 MM THICKNESS FOR MAPBGA AND UNLIDDED NXP CPUS + MYLAR |
