info@yc-chip.com
- Manufacturer :
- Digilent
- Product Category :
- Programmable Logic IC Development Tools
- Product :
- Development Boards
- Tool Is For Evaluation Of :
- XCZU2CG?
- Type :
- SoC FPGA
- Datasheets
- 360-076
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Related products
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| 360-076 | Digilent | 3 | Programmable Logic IC Development Tools Trenz TE0802: Zynq UltraScale+ MPSoC Development Board |
| 360-10-102-00-001000 | Mill-Max | 5,000 | Board to Board & Mezzanine Connectors Interconnect Header |
| 360-10-102-00-001101 | Preci-Dip | 5,000 | Headers & Wire Housings |
| 360-10-103-00-001000 | Mill-Max | 5,000 | Board to Board & Mezzanine Connectors Interconnect Header |
| 360-10-103-00-001101 | Preci-Dip | 650 | Headers & Wire Housings |
| 360-10-104-00-001000 | Mill-Max | 5,000 | Board to Board & Mezzanine Connectors Interconnect Header |
| 360-10-104-00-001101 | Preci-Dip | 5,000 | Headers & Wire Housings |
| 360-10-105-00-001000 | Mill-Max | 5,000 | Board to Board & Mezzanine Connectors Interconnect Header |
| 360-10-105-00-001101 | Preci-Dip | 5,000 | Headers & Wire Housings |
| 360-10-106-00-001000 | Mill-Max | 5,000 | Board to Board & Mezzanine Connectors Interconnect Header |
| 360-10-106-00-001101 | Preci-Dip | 5,000 | Headers & Wire Housings |
| 360-10-107-00-001000 | Mill-Max | 5,000 | Board to Board & Mezzanine Connectors Interconnect Header |
| 360-10-107-00-001101 | Preci-Dip | 5,000 | Headers & Wire Housings |
| 360-10-108-00-001000 | Mill-Max | 5,000 | Board to Board & Mezzanine Connectors Interconnect Header |
| 360-10-108-00-001101 | Preci-Dip | 5,000 | Headers & Wire Housings |
