info@yc-chip.com
- Manufacturer :
- Advantech
- Product Category :
- Development Boards & Kits - x86
- Core :
- Intel Atom, ARM Cortex A9
- Product :
- Development Boards
- Tool Is For Evaluation Of :
- SOM-DB3500
- Datasheets
- SOMDB3500G01A1E-ES
Manufacturer related products
Catalog related products
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congatecDevelopment Boards & Kits - x86 3.5 Application Carrier Board for x86 based SMARC 2.0 modules. -
congatecDevelopment Boards & Kits - x86 EVALUATION CARRIER BRD FOR QSEVEN 2.0
-
ADLINK TechnologyDevelopment Boards & Kits - x86 Vizi-AI Industrial Machine Vision AI Developer Kit - European version
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ADLINK TechnologyDevelopment Boards & Kits - x86 Starterkit-COM Express 6 PLUS with cExpress-KL-i7-7600U Compact size Type 6 module, H/P passive heatsink, 16GB DDR4 2133 non-ECC SODIMM, operating temperature 0C to 60C degree
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congatecDevelopment Boards & Kits - x86 Evaluation Carrier Board for COM Express Type 7 modules with four 10GbE SFP+ fiber/copper ports. The carrier features an Aspeed AST2500 Board Management Controller (BMC). Commercial temperature range from 0 C to 60 C.
Related products
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| SOMDB2 | VIA Technologies | 1 | Development Boards & Kits - ARM Evaluation carrier board for SOM-9X20, HDMI 2.0, MIPI, USB3.0, Ethernet |
| SOMDIMM-LPC1788 | Future Designs, Inc. (FDI) | 4 | System-On-Modules - SOM LPC1788 SOM DIMM Module |
| SOMDIMM-LPC2478 | Future Designs, Inc. (FDI) | 5,000 | System-On-Modules - SOM LPC2478 SOM DIMM Module |
| SOMDIMM-RX62N | Future Designs, Inc. (FDI) | 5,000 | System-On-Modules - SOM RENESAS RX62N SOM DIMM MODULE |
| SOMDIMM-RX63N | Future Designs, Inc. (FDI) | 5,000 | System-On-Modules - SOM RX63N SOMDIMM Module 16MB, ETH, Rev 2.0 |
