info@yc-chip.com
OSD3358-SM-RED
- Mfr.Part #
- OSD3358-SM-RED
- Manufacturer
- Octavo Systems
- Package/Case
- -
- Datasheet
- Download
- Description
- Development Boards & Kits - ARM OSD335x-SM RED Eval Board
Request A Quote(RFQ)
- * Contact Name:
- * Company:
- * E-Mail:
- * Phone:
- * Comment:
- * Captcha:
-
- Manufacturer :
- Octavo Systems
- Product Category :
- Development Boards & Kits - ARM
- Core :
- ARM Cortex A8
- Product :
- Development Boards
- Series :
- OSD3358
- Tool Is For Evaluation Of :
- OSD3358-512M-BSM
- Datasheets
- OSD3358-SM-RED
Manufacturer related products
-
-
Octavo SystemsSystem-On-Modules - SOM System-in-Package: ST Micro STM32MP157C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 0 C to 85 C -
Octavo SystemsSystem-On-Modules - SOM System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 512MB DDR3, TPS65217C PMIC, TL5209 LDO, 4KB EEPROM, Passives - 21mm X 21mm 256 Ball BGA - -40 C to 85 C
-
Octavo SystemsSystem-On-Modules - SOM Complete System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 512MB DDR2, TPS65217C PMIC, TL5209 LDO, 4GB eMMC, 24MHz Oscillator, 4KB EEPROM, Passives - 27mm x 27mm 400 Ball BGA - 0 C to 85 C
-
Octavo SystemsSystem-On-Modules - SOM System-in-Package: ST Micro STM32MP157C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - -40 C to 85 C
Catalog related products
-
STMicroelectronicsDevelopment Boards & Kits - ARM STM32 Nucleo-144 dev board, STM32H723ZG MCU, supports Arduino, ST Zio & morpho
-
-
STMicroelectronicsDevelopment Boards & Kits - ARM Discovery kit with STM32MP157F MPU
-
NXP SemiconductorsDevelopment Boards & Kits - ARM Evaluation Kit for the i.MX 8M Nano Applications Processor with NXP Wi-Fi/BT solution and NXP PMIC
-
Related products
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| OSD32MP1-BRK | Octavo Systems | 3 | Development Boards & Kits - ARM Flexible Prototyping Platform for the OSD32MP1 System in Package |
| OSD32MP1-RED | Octavo Systems | 46 | Development Boards & Kits - ARM Reference, Evaluation, Development board for the OSD32MP15x Family of System-in-Package Devices |
| OSD32MP157C-512M-BAA | Octavo Systems | 549 | System-On-Modules - SOM System-in-Package: ST Micro STM32MP157C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 0 C to 85 C |
| OSD32MP157C-512M-IAA | Octavo Systems | 1,267 | System-On-Modules - SOM System-in-Package: ST Micro STM32MP157C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - -40 C to 85 C |
| OSD3358-1G-ISM | Octavo Systems | 455 | System-On-Modules - SOM System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 1GBB DDR3, TPS65217C PMIC, TL5209 LDO, 4KB EEPROM, Passives - 21mm X 21mm 256 Ball BGA - -40 C to 85 C |
| OSD3358-512M-BAS | Octavo Systems | 194 | System-On-Modules - SOM AM3358 512MB DDR3 System-In-Package |
| OSD3358-512M-BCB | Octavo Systems | 623 | System-On-Modules - SOM Complete System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 512MB DDR2, TPS65217C PMIC, TL5209 LDO, 4GB eMMC, 24MHz Oscillator, 4KB EEPROM, Passives - 27mm x 27mm 400 Ball BGA - 0 C to 85 C |
| OSD3358-512M-BSM | Octavo Systems | 1,800 | System-On-Modules - SOM AM3358 512MB DDR3 System-In-Package |
| OSD3358-512M-ICB | Octavo Systems | 873 | System-On-Modules - SOM Complete System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 512MB DDR2, TPS65217C PMIC, TL5209 LDO, 4GB eMMC, 24MHz Oscillator, 4KB EEPROM, Passives - 27mm x 27mm 400 Ball BGA - -40 C to 85 C |
| OSD3358-512M-IND | Octavo Systems | 120 | System-On-Modules - SOM AM3358 512MB DDR3 System-In-Package |
| OSD3358-512M-ISM | Octavo Systems | 693 | System-On-Modules - SOM System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 512MB DDR3, TPS65217C PMIC, TL5209 LDO, 4KB EEPROM, Passives - 21mm X 21mm 256 Ball BGA - -40 C to 85 C |
