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533514-1
- Mfr.Part #
- 533514-1
- Manufacturer
- TE Connectivity / AMP Connectors
- Package/Case
- -
- Datasheet
- Download
- Description
- High Speed / Modular Connectors HDI RECP ASSY 3 ROW
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- Manufacturer :
- TE Connectivity / AMP Connectors
- Product Category :
- High Speed / Modular Connectors
- Contact Plating :
- Gold
- Number of Positions :
- 240 Position
- Number of Rows :
- 3 Row
- Packaging :
- Tube
- Pitch :
- 2.54 mm
- Product :
- Receptacles
- Series :
- AMP-HDI
- Termination Style :
- Through Hole
- Datasheets
- 533514-1
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Catalog related products
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|---|---|---|---|
| 533502B02552G | Aavid, Thermal Division of Boyd Corporation | 5,000 | Heat Sinks Extruded Style Heat Sink for TO-220, Large Radial Fins, Vertical Mounting, 4.5 n Thermal Resistance, Black Anodized, 2.67mm, Device Clip #52 Hole, 50.8x18.29mm |
| 533521B02552G | Aavid, Thermal Division of Boyd Corporation | 5,000 | Heat Sinks Extruded Style Heat Sink for Dual TO-218, Large Radial Fins, Vertical Mounting, 4.5 n Thermal Resistance, Black Anodized, 2.67mm Hole, 50.8x21.59mm, 2 Device Clips #52 |
| 533522B02552G | Aavid, Thermal Division of Boyd Corporation | 5,000 | Heat Sinks Extruded Style Heat Sink for Dual TO-220, Large Radial Fins, Vertical Mounting, 2.7 n Thermal Resistance, Black Anodized, 2.67mm Hole, 50.8x18.29mm, 2 Device Clips #52 |
| 53353-1071 | Molex | 6,713 | Board to Board & Mezzanine Connectors 0.8 BtB Wafer Assy S T SMT 10CktEmbsTpPkg |
| 53353-1671 | Molex | 5,000 | Board to Board & Mezzanine Connectors 0.8 BtB Wafer Assy S T SMT 16CktEmbsTpPkg |
| 53353-1871 | Molex | 5,000 | Board to Board & Mezzanine Connectors 0.8 BtB Wafer Assy S T SMT 18CktEmbsTpPkg |
| 53353-2071 | Molex | 5,000 | Board to Board & Mezzanine Connectors 0.8 BtB Wafer Assy S T SMT 20CktEmbsTpPkg |
| 53353-2871 | Molex | 998 | Board to Board & Mezzanine Connectors 0.8 BtB Wafer Assy S T SMT 28CktEmbsTpPkg |
| 53353-3071 | Molex | 67 | Board to Board & Mezzanine Connectors 0.8 BtB Wafer AssyST SMT 30CktEmbsTpPkg |
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