info@yc-chip.com
- Manufacturer：
-
- CUI Devices (1)
- Designed for：
-
- Heatsink Material：
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- Fin Style：
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- Thermal Resistance：
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11 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | Heat Sinks heat sink, BGA... |
-
|
679
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions | Heat Sinks maxiFLOW Hea... |
-
|
100
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions | Heat Sinks maxiFLOW Hea... |
-
|
140
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions | Heat Sinks maxiFLOW Hea... |
-
|
100
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions | Heat Sinks maxiFLOW Hea... |
-
|
86
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions | Heat Sinks maxiFLOW Hea... |
-
|
5,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions | Heat Sinks maxiFLOW Hea... |
-
|
5,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions | Heat Sinks maxiFLOW Hea... |
-
|
5,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions | Heat Sinks maxiFLOW Hea... |
-
|
5,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions | Heat Sinks maxiFLOW BG... |
-
|
5,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions | Heat Sinks maxiFLOW BG... |
-
|
5,000
In-stock
|
Get Quote |
